High Pressure Laminate, Compact Laminate, Post-forming Laminate, Melamine Faced Chipboard, Copper Clad Laminate Sheets, Methbond Electronic Sheets
THE COMPANY
High Pressure Laminate, Compact Laminate, Post-forming Laminate, Melamine Faced Chipboard, Copper Clad Laminate Sheets, Methbond Electronic Sheets
| Type d'entreprise | Manufacturer & Trading Company |
| Année de création | 2001 |
| Employés au total | 3 |
| Capacités | OEM,ODM |
| Conditions commerciales | FOB,CIF,CFR,EXW |
| Pays | China |
| Adresse | Weixing District, Cuiwei Road, Henlin Town, Changzhou, Jiangsu |
INSIDE THE FACILITY — 5 PHOTOS
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